Turnkey PCB assembly forms a core part of our manufacturing capability. We support all levels of production from low volume prototypes to the ongoing, sustained production requirements needed to get your products to market.
We offer prototype assembly for surface mount, through hole and mixed PCB assemblies. Prototypes can also be manufactured either leaded or lead free.
BGA (Ball Grid Array), QFN (Quad-flat no-leads) and SM (Surface Mount) Assembly
Our surface mount capabilities include BGA (Ball Grid Array), QFN (Quad-flat no-leads) and fine pitch components. Automated assembly processes are used throughout the manufacturing cycles to ensure consistent, sustained quality coupled with optimum manufacturing costs.
Mixed Technology and Through Hole Assembly
We have full capability for through-hole and mixed technology assembly. We also offer a host of supporting services such as conformal coating, encapsulation and device programming.
We utilize AOI (automated optical inspection) to ensure any defects in manufacturing can be identified and corrected prior to delivery. We also work with customers to develop unique functional testing for more complex test requirements.
QCA is one of only 75 contract manufacturers worldwide approved for PCB assembly by Underwriters Laboratories.